Keynote Speakers


Sheng Liu



This lecture first briefly introduces the development of semiconductor materials, power electronic devices and their applications. It focuses on the three major industry pain points in the application of power electronic devices, thereby leading to DFX, that is, the design and manufacturing of power electronic chips and packages based on digital twin technology, and the importance to the development of the industry. At the same time, the report introduces in detail the development and application of digital twin technology in the field of power electronics technology. It includes the innovative theory of chip and package design and manufacturing technology based on digital twin, the digital twin technologies in material analysis, characterization and testing. It also covers the chip and package reliability and manufacturability design, virtual manufacturing, key equipment research and development. The future development direction of power electronics field facing the pain point of the industry is then put forward.